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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10580640 B1

PDFFull Text
Date of Patent:
Mar. 03, 2020

Filed:

Sep. 22, 2017

Kit and laminate

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Yoshitaka Kamochi, Shizuoka, JP;

Yu Iwai, Shizuoka, JP;

Ichiro Koyama, Shizuoka, JP;

Atsushi Nakamura, Zwijndrecht, BE;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Shane Fang

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C09J 121/00 (2006.01); C09J 201/00 (2006.01); H01L 21/304 (2006.01); H01L 21/311 (2006.01); H01L 21/683 (2006.01); C09J 125/04 (2006.01); C09J 153/00 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/022 (2013.01); C09J 5/06 (2013.01); C09J 121/00 (2013.01); C09J 125/04 (2013.01); C09J 153/00 (2013.01); C09J 201/00 (2013.01); H01L 21/02057 (2013.01); H01L 21/02304 (2013.01); H01L 21/304 (2013.01); H01L 21/31133 (2013.01); H01L 21/6835 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68386 (2013.01);
Abstract

Provided are a kit and a laminate which are capable of suppressing residues derived from a temporary adhesive in manufacture of a semiconductor. The kit for manufacturing a semiconductor device includes a composition which contains a solvent A; a composition which contains a solvent B; and a composition which contains a solvent C, in which the kit is used when a temporary adhesive layer is formed on a first substrate using a temporary adhesive composition containing a temporary adhesive and the solvent A, at least some of an excessive amount of the temporary adhesive on the first substrate is washed using the composition containing the solvent B, a laminate is manufactured by bonding the first substrate and a second substrate through the temporary adhesive layer, one of the first substrate and the second substrate is peeled off from the laminate at a temperature of lower than 40° C., and then the temporary adhesive remaining on at least one of the first substrate or the second substrate is washed using the composition containing the solvent C, and the solvent A, the solvent B, and the solvent C respectively satisfy a predetermined vapor pressure and a predetermined saturated solubility.

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