The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2020

Filed:

Jul. 25, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Luciana Meli Thompson, Albany, NY (US);

Ekmini A. De Silva, Slingerlands, NY (US);

Yasir Sulehria, New York, NY (US);

Nelson Felix, Slingerlands, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/02 (2006.01); G03F 7/16 (2006.01); C23C 16/30 (2006.01); C23C 16/40 (2006.01); C23C 16/455 (2006.01); H01L 21/67 (2006.01); H01L 21/027 (2006.01); C23C 16/56 (2006.01);
U.S. Cl.
CPC ...
G03F 7/7065 (2013.01); C23C 16/308 (2013.01); C23C 16/405 (2013.01); C23C 16/45536 (2013.01); C23C 16/56 (2013.01); G03F 7/16 (2013.01); H01L 21/0206 (2013.01); H01L 21/0228 (2013.01); H01L 21/0273 (2013.01); H01L 21/02172 (2013.01); H01L 21/02274 (2013.01); H01L 21/67288 (2013.01);
Abstract

Methods for post-lithographic inspection using an e-beam inspection tool of organic extreme ultraviolet sensitive (EUV) sensitive photoresists generally includes conformal deposition of a removable metal carboxide or metal carboxynitride onto the relief image. The conformal deposition of the metal carboxide or metal carboxynitride includes a low temperature vapor deposition process of less than about 100° C. to provide a coating thickness of less than about 5 nanometers. Subsequent to e-beam inspection, the metal carboxide or metal carboxynitride coating is removed using a wet stripping process. Once stripped, the wafer can continue on to further process fabrication without being a sacrificial wafer.


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