The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2020
Filed:
Oct. 15, 2017
Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;
Mingzhu Wang, Ningbo, CN;
Bojie Zhao, Ningbo, CN;
Takehiko Tanaka, Ningbo, CN;
Nan Guo, Ningbo, CN;
Zhenyu Chen, Ningbo, CN;
Heng Jiang, Ningbo, CN;
Zhongyu Luan, Ningbo, CN;
Fengsheng Xi, Ningbo, CN;
Feifan Chen, Ningbo, CN;
Liang Ding, Ningbo, CN;
Ningbo Sunny Opotech Co., Ltd., Ningbo, Zhejiang, CN;
Abstract
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units coupled at the chip coupling area of the circuit board, at least two lead wires electrically connected the photosensitive units at the chip coupling area of the circuit board, and a mold sealer which includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile