The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Aug. 31, 2018
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Kurt B. Smith, Eagle, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/42 (2006.01); H01R 12/72 (2011.01);
U.S. Cl.
CPC ...
H05K 3/423 (2013.01); H01R 12/721 (2013.01); H05K 1/111 (2013.01); H05K 1/117 (2013.01); H05K 1/114 (2013.01);
Abstract
Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.