The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Sep. 18, 2017
Applicants:

Honda Motor Co., Ltd., Tokyo, JP;

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Hideki Shigematsu, Tochigi, JP;

Masafumi Saito, Tochigi, JP;

Keita Miyashita, Tochigi, JP;

Ryuzo Sakamoto, Tochigi, JP;

Hiroyuki Miyajima, Nagano, JP;

Akio Komamura, Nagano, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02G 1/12 (2006.01); H01B 15/00 (2006.01);
U.S. Cl.
CPC ...
H02G 1/126 (2013.01); H01B 15/006 (2013.01); H02G 1/127 (2013.01); H02G 1/1285 (2013.01); Y02W 30/821 (2015.05);
Abstract

A peeling apparatusincludes a first peeling die and a second peeling die respectively including a pair of cutting bladesthat peels the insulating film by being moved in a direction perpendicular to an axial direction of the conductive wire materialto cut the insulating film, and a support diethat supports a side surface of the conductive wire materialfrom a downstream side in a moving direction of the cutting bladesat the time of cutting by the cutting blades, the support dieof the first peeling die including a convex portionprotruding toward the conductive wire material


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