The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Sep. 26, 2016
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Yoshinobu Nakada, Saitama, JP;

Toshiyuki Nagase, Naka, JP;

Masahito Komasaki, Saitama, JP;

Yoshiyuki Nagatomo, Saitama, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 35/10 (2006.01); H01L 35/32 (2006.01); H01L 35/08 (2006.01); H01L 35/30 (2006.01); H01L 35/22 (2006.01);
U.S. Cl.
CPC ...
H01L 35/10 (2013.01); H01L 35/08 (2013.01); H01L 35/30 (2013.01); H01L 35/32 (2013.01); H01L 35/22 (2013.01);
Abstract

A thermoelectric conversion module in which a plurality of P-type thermoelectric conversion elements and N-type thermoelectric conversion elements, which are combined in pairs, are connected in series between a pair of opposing wiring substrates via the wiring substrates: electrode parts to which the thermoelectric conversion elements are connected, are formed on surfaces of ceramic substrates of the wiring substrates: among the thermoelectric conversion elements, the thermoelectric conversion element having a larger thermal expansion coefficient has the length, in a direction in which the wiring substrates face each other, that is smaller than the length, in a direction in which the wiring substrates face each other, of the thermoelectric conversion element having a smaller thermal expansion coefficient: an electrically conductive spacer is interposed between at least one of the two ends of the thermoelectric conversion element having a larger thermal expansion coefficient and the ceramic substrate of the wiring substrate.


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