The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jan. 28, 2016
Applicant:
Catlam, Llc, Sunnyvale, CA (US);
Inventors:
Kenneth S. Bahl, Saratoga, CA (US);
Konstantine Karavakis, Pleasanton, CA (US);
Assignee:
CATLAM, LLC, Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 2224/03464 (2013.01); Y10T 29/49155 (2015.01);
Abstract
Wafer level packaging includes a first layer of a catalytic adhesive on a wafer surface. The catalytic adhesive includes catalytic particles that will reduce electroless copper (Cu) from Cuto Cu. Metal traces are formed in trace channels within the first layer of catalytic adhesive. The trace channels extend below a surface of the first layer of the catalytic material. The trace metals traces are also in contact with integrated circuit pads on the surface of the wafer.