The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 25, 2020
Filed:
Jun. 22, 2018
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventors:
Mao-Ying Wang, New Taipei, TW;
Pei-Lin Huang, Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 23/5225 (2013.01); H01L 23/5226 (2013.01); H01L 24/05 (2013.01); H01L 2224/023 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/02373 (2013.01); H01L 2224/02381 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05093 (2013.01); H01L 2224/05564 (2013.01); H01L 2224/05569 (2013.01);
Abstract
The present disclosure provides a semiconductor device. The semiconductor device includes a first die and a conductive layer. The first die is to be bonded with, in a direction, a second die external to the semiconductor device. The conductive layer, between the first die and the second die in the direction, has a reference ground.