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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10573577 B1

PDFFull Text
Date of Patent:
Feb. 25, 2020

Filed:

Jun. 25, 2015

Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Wataru Iwazaki, Kumagaya, JP;

Hiroya Ishiduka, Koshigaya, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Karuna P Reddy

Int. Cl.
CPC ...
C04B 37/02 (2006.01); B32B 37/06 (2006.01); B32B 37/08 (2006.01); H01L 23/373 (2006.01); B32B 9/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); B32B 9/005 (2013.01); B32B 37/06 (2013.01); C04B 37/025 (2013.01); H01L 21/4882 (2013.01); B32B 2309/105 (2013.01); C04B 2237/16 (2013.01); C04B 2237/366 (2013.01); C04B 2237/402 (2013.01); C04B 2237/525 (2013.01); C04B 2237/60 (2013.01); C04B 2237/706 (2013.01);
Abstract

A method for producing a ceramic-aluminum bonded body obtained by bonding a ceramic member and an aluminum member, the aluminum member before bonding being composed of aluminum having a purity of 99.0 mass % or higher and 99.9 mass % or lower, includes a heat treatment step of subjecting the aluminum member to a heat treatment in a range of 400° C. or higher and lower than a solidus temperature, and a bonding step of bonding the aluminum member after the heat treatment step and the ceramic member via a brazing filler material including Si.

Find Patent Forward Citations

Iwazaki, Wataru. (2020). Method for producing ceramic-aluminum bonded body, method for producing power module substrate, ceramic-aluminum bonded body, and power module substrate (U.S. Patent No. 10573577). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10573577

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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