The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Sep. 14, 2016
Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Hiroto Akaike, Naka, JP;

Kazuhiko Yamasaki, Naka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); C09D 5/24 (2006.01); B82Y 30/00 (2011.01); H01B 5/14 (2006.01); C09D 7/40 (2018.01); C09D 201/00 (2006.01); H01B 1/00 (2006.01); C09D 11/52 (2014.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); C09D 5/24 (2013.01); C09D 7/40 (2018.01); C09D 11/52 (2013.01); C09D 201/00 (2013.01); H01B 1/00 (2013.01); H01B 5/14 (2013.01);
Abstract

This electrically conductive paste contains a solvent, a binder resin that does not contain unsaturated bonds within the molecules, and silver-coated resin particles as an electrically conductive filler dispersed in the binder resin. The silver-coated resin particles include resin core particles comprising silicone rubber particles, and a silver coating layer covering the surface of the resin core particles. Furthermore, the average grain diameter of the silver-coated resin particles is 0.5-20 μm, and the silver-coated resin particles are contained at 30-75 vol. % with respect to 100 vol. % of the solids content of the electrically conductive paste.


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Akaike, Hiroto. (2020). Electrically conductive paste and electrically conductive film formed by using same (U.S. Patent No. 10573425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10573425

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