The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Oct. 26, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

David M. Audette, Colchester, VT (US);

Dennis M. Bronson, Jr., Milton, VT (US);

Joseph K. V. Comeau, Alburgh, VT (US);

Dustin M. Fregeau, South Burlington, VT (US);

David L. Gardell, Fairfax, VT (US);

Frederick H. Roy, III, Burlington, VT (US);

James R. Salimeno, III, Fairfax, VT (US);

Timothy D. Sullivan, Underhill, VT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 3/00 (2006.01); G01R 1/073 (2006.01); G01R 31/28 (2006.01); G01R 1/067 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/06738 (2013.01); G01R 1/07314 (2013.01); G01R 1/07342 (2013.01); G01R 31/2886 (2013.01);
Abstract

A probe tip structure that decreases the accumulation rate of Sn particles to the probe tip and enables considerably more efficient and complete laser cleaning is disclosed. In an embodiment, the probe structure includes an array of probe tips, each probe tip having an inner core; an interfacial layer bonded to the inner core; and an outer layer bonded to the interfacial layer, wherein the outer layer is resistant to adherence of the solder of the ball grid array package.


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