The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2020

Filed:

Feb. 15, 2018
Applicant:

Kemet Electronics Corporation, Simpsonville, SC (US);

Inventors:

Yang Jin, Jiangsu, CN;

Qingping Chen, Simpsonville, SC (US);

Assignee:

KEMET Electronics Corporation, Fort Lauderdale, FL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 28/00 (2006.01); C07D 409/14 (2006.01); C08G 75/06 (2006.01); C25B 3/00 (2006.01); H01G 9/15 (2006.01); H01G 9/042 (2006.01);
U.S. Cl.
CPC ...
C23C 28/00 (2013.01); C07D 409/14 (2013.01); C08G 75/06 (2013.01); C25B 3/00 (2013.01); H01G 9/0425 (2013.01); H01G 9/15 (2013.01);
Abstract

An improved process for forming a conjugated thiophene precursor is described as in the formation of an improved polymer prepared from the conjugated thiophene and an improved capacitor formed from the improved polymer. The improved process includes forming a thiophene mixture comprising thiophene monomer, unconjugated thiophene oligomer, optionally a solvent and heating the thiophene mixture at a temperature of at least 100° C. to no more than the lower of 250° C. or the boiling point of a component of said thiophene mixture with the lowest boiling point temperature.


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