The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Nov. 26, 2015
Zeon Corporation, Tokyo, JP;
Intel Corporation, Santa Clara, CA (US);
Abstract
The present invention enables the manufacture of a small-sized high-density multi-layer printed circuit board. The manufacturing method for a multi-layer printed circuit board, according to the present invention, comprises: a step in which an electrical insulation layer is formed by heating a laminate comprising a substrate, a heat-curable resin composition layer provided on the substrate, and a release substrate provided on the heat-curable resin composition layer, thereby curing the heat-curable resin composition layer, and a step in which a via hole is formed in the electrical insulation layer by irradiating a laser from above the release substrate. In addition, in the present invention, the release substrate has a thickness of at least 80 μm and is formed using a material having a glass transition temperature, the heat-curable resin composition layer has a volatile component-content of 7.0 mass % or less and a thickness of 25 μm or less, and the curing of the heat-curable resin composition layer occurs at a temperature that is not less than the glass transition temperature of the material of the release substrate.