The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Sep. 01, 2016
Applicant:

AT & S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventors:

Christian Galler, Leoben, AT;

Gerhard Stubenberger, Trofaiach, AT;

Markus Leitgeb, Trofaiach, AT;

Wolfgang Schrittwieser, Kapfenberg, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H01L 23/13 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H05K 3/30 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H05K 1/188 (2013.01); H01L 21/56 (2013.01); H01L 23/13 (2013.01); H01L 24/00 (2013.01); H05K 3/30 (2013.01); H01L 23/3107 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 2224/18 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/09509 (2013.01); H05K 2203/1469 (2013.01);
Abstract

An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.


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