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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10568208 B1

PDFFull Text
Expired
Date of Patent:
Feb. 18, 2020

Filed:

Jul. 28, 2017

Component carrier with a bypass capacitance comprising dielectric film structure

Applicant:

At&s Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, AT;

Inventor:

Wilhelm Tamm, Salem, DE;

Assignee:

AT & S AUSTRIA TECHNOLOGIE & SYSTEMTECHNIK AKTIENGESELLSCHAFT, Leoben, AT;

Attorneys:

Robert A. Blaha

Smith Tempel Blaha LLC

Primary Examiner:

Hoa C Nguyen

Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 1/16 (2006.01); H05K 1/02 (2006.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H05K 3/46 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/162 (2013.01); H01L 21/4857 (2013.01); H01L 23/49822 (2013.01); H01L 23/49833 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H05K 1/0231 (2013.01); H05K 1/181 (2013.01); H05K 3/467 (2013.01); H01L 23/49827 (2013.01); H01L 23/49866 (2013.01); H01L 23/49877 (2013.01); H01L 23/49894 (2013.01); H01L 24/16 (2013.01); H01L 2223/6666 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19041 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/09 (2013.01); H05K 1/115 (2013.01); H05K 3/3436 (2013.01); H05K 2201/10734 (2013.01);
Abstract

There is provided a component carrier comprising: (a) a stack of at least one electrically conductive layer structure and at least one electrically insulating layer structure; and (b) a bypass capacitance structure formed on an/or within the stack. The bypass capacitance structure comprises an electrically conductive film structure having a rough surface, a dielectric film structure formed on the rough surface, and a further electrically conductive film structure formed on the dielectric film structure.

Find Patent Forward Citations

Tamm, Wilhelm. (2020). Component carrier with a bypass capacitance comprising dielectric film structure (U.S. Patent No. 10568208). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10568208

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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