The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10566506 B1

PDF
Full Text
Expired
Date of Patent:
Feb. 18, 2020

Filed:

Nov. 15, 2017
Applicant:

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Yadan Xiao, Guangdong, CN;

Shibo Jiao, Guangdong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 33/56 (2010.01); H01L 33/06 (2010.01); H01L 33/64 (2010.01); H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/06 (2013.01); H01L 33/641 (2013.01); H01L 27/15 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0075 (2013.01);
Abstract

The present disclosure provides a packaging method and a package structure of a QLED device. The packaging method of the QLED device forming a thin film encapsulation layer in which a plurality of inorganic barrier layers and at least one organic buffer layer are arranged alternately on a QLED device to seal the QLED device against water and oxygen, and the organic buffer layer is further doped with a thermal conducting material, so that the heat generated by the QLED device can be promptly transmitted through the thin film encapsulation layer to improve the heat dissipation of the thin film encapsulation layer, thereby improving the light extraction efficiency and the service life of the QLED device.


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