The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Dec. 11, 2018
Applicant:

Winbond Electronics Corp., Taichung, TW;

Inventors:

Chung-Hsien Liu, Taichung, TW;

Chun-Hsu Chen, Taichung, TW;

Lu-Ping Chiang, Taichung, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11531 (2017.01); H01L 21/762 (2006.01); H01L 27/11521 (2017.01); H01L 27/11541 (2017.01); H01L 21/311 (2006.01); H01L 21/3115 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11531 (2013.01); H01L 21/76237 (2013.01); H01L 27/11521 (2013.01); H01L 27/11541 (2013.01); H01L 21/31111 (2013.01); H01L 21/31116 (2013.01); H01L 21/31155 (2013.01); H01L 29/40114 (2019.08);
Abstract

Provided is a method of manufacturing a memory device including following steps. A substrate including an active region and a periphery region. A stack layer is formed on the substrate. A first trench is formed in the substrate and the stack layer in the active region. A first isolation structure is formed in the first trench. An ion implantation process is performed to form a doped first isolation structure. A first wet etching process is performed to remove a portion of the doped first isolation structure, so that a first recess is formed on the doped first isolation structure. A protection layer is formed on the substrate to at least cover sidewalls of the first recess. A second wet etching process is performed to remove the protection layer and another portion of the doped first isolation structure and deepen the first recess. A SICONI etching process is performed.


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