The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Mar. 25, 2016
Applicant:

Technology Research Association for Future Additive Manufacturing, Tokyo, JP;

Inventors:

Zhixiong Yuan, Tokyo, JP;

Kazuya Goto, Tokyo, JP;

Toshiyuki Morimura, Tokyo, JP;

Takahiro Shimbo, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 37/147 (2006.01); B23K 15/00 (2006.01); H01J 37/302 (2006.01); B33Y 30/00 (2015.01); B22F 3/105 (2006.01); H01J 37/21 (2006.01); B33Y 10/00 (2015.01); B33Y 50/02 (2015.01); B29C 64/153 (2017.01); B29C 64/393 (2017.01); B29C 64/268 (2017.01); B29C 64/205 (2017.01); B23K 15/02 (2006.01); H01J 37/10 (2006.01); H01J 37/305 (2006.01); G21K 1/08 (2006.01); B29C 64/10 (2017.01); B29C 64/20 (2017.01);
U.S. Cl.
CPC ...
H01J 37/1474 (2013.01); B22F 3/1055 (2013.01); B23K 15/002 (2013.01); B23K 15/0013 (2013.01); B23K 15/0033 (2013.01); B23K 15/0086 (2013.01); B23K 15/02 (2013.01); B29C 64/153 (2017.08); B29C 64/205 (2017.08); B29C 64/268 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); H01J 37/10 (2013.01); H01J 37/21 (2013.01); H01J 37/305 (2013.01); H01J 37/3023 (2013.01); B22F 2003/1056 (2013.01); B22F 2003/1057 (2013.01); B22F 2999/00 (2013.01); B29C 64/10 (2017.08); B29C 64/20 (2017.08); G21K 1/08 (2013.01); H01J 2237/30472 (2013.01); H01J 2237/30483 (2013.01); H01J 2237/3128 (2013.01); Y02P 10/295 (2015.11);
Abstract

This invention can maintain the temperature of the shaping plane in a three-dimensional layer-by-layer shaping apparatus. A three-dimensional layer-by-layer shaping apparatus includes a material spreader that spreads the material or materials of a three-dimensional layer-by-layer shaped object onto the shaping plane on which the three-dimensional layer-by-layer shaped object is to be shaped; an electron gun that generates an electron beam; at least one deflector that deflects the electron beam so that it scans the shaping plane one- or two-dimensionally; at least one lens that is positioned between the electron gun and the deflector, and focuses the electron beam; a focus controller that controls the focus of the electron beam based on which region is to be scanned by the electron beam; and a controller that controls the deflecting direction of the deflector and the scanning rate.


Find Patent Forward Citations

Yuan, Zhixiong. (2020). Three-dimensional layer-by-layer shaping apparatus, three-dimensional layer-by-layer shaping apparatus control method, and three-dimensional layer-by-layer shaping apparatus control program (U.S. Patent No. 10566171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10566171

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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