The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Nov. 16, 2015
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Dominic J. Benvegnu, La Honda, CA (US);

Robert D. Tolles, San Jose, CA (US);

Boguslaw A. Swedek, Cupertino, CA (US);

Abraham Ravid, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); G06T 7/00 (2017.01); G06F 3/0486 (2013.01); G06T 7/40 (2017.01); G06T 5/00 (2006.01); G06T 5/50 (2006.01); H04N 9/04 (2006.01); G06F 3/0484 (2013.01);
U.S. Cl.
CPC ...
G06T 7/0006 (2013.01); B24B 37/013 (2013.01); G06F 3/0486 (2013.01); G06F 3/04842 (2013.01); G06F 3/04847 (2013.01); G06T 5/002 (2013.01); G06T 5/50 (2013.01); H04N 9/04 (2013.01); G06T 2207/10024 (2013.01); G06T 2207/20024 (2013.01); G06T 2207/20216 (2013.01); G06T 2207/30148 (2013.01);
Abstract

A polishing system includes a polishing station including a platen to support a polishing pad, a support to hold a substrate, an in-line metrology station to measure the substrate before or after polishing of a surface of the substrate in the polishing station, and a controller. The in-line metrology station includes a color line-scan camera, a white light source, a frame supporting the light source and the camera, and a motor to cause relative motion between the camera and the support along a second axis perpendicular to the first axis to cause the light source and the camera to scan across the substrate. The controller is configured to receive a color data from the camera, to generate a 2-dimensional color image from the color data, and to control polishing at the polishing station based on the color image.


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