The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Apr. 07, 2017
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Xiangjin Xie, Fremont, CA (US);

Adolph Miller Allen, Oakland, CA (US);

Xianmin Tang, San Jose, CA (US);

Goichi Yoshidome, Albany, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3215 (2006.01); H01L 21/768 (2006.01); C23C 14/34 (2006.01); H01L 21/321 (2006.01); C23C 14/54 (2006.01); H01L 21/683 (2006.01); H01L 21/285 (2006.01); C23C 16/455 (2006.01); C23C 14/58 (2006.01); C23C 14/22 (2006.01); C23C 16/02 (2006.01); C23C 14/56 (2006.01); C23C 16/56 (2006.01); H01J 37/32 (2006.01); C23C 14/02 (2006.01); H01L 23/532 (2006.01); H01J 37/34 (2006.01); H01J 3/34 (2006.01);
U.S. Cl.
CPC ...
C23C 16/45525 (2013.01); C23C 14/024 (2013.01); C23C 14/225 (2013.01); C23C 14/345 (2013.01); C23C 14/3464 (2013.01); C23C 14/3471 (2013.01); C23C 14/541 (2013.01); C23C 14/564 (2013.01); C23C 14/5873 (2013.01); C23C 16/0272 (2013.01); C23C 16/56 (2013.01); H01J 37/321 (2013.01); H01J 37/32146 (2013.01); H01J 37/34 (2013.01); H01L 21/2855 (2013.01); H01L 21/321 (2013.01); H01L 21/3215 (2013.01); H01L 21/6831 (2013.01); H01L 21/76856 (2013.01); H01L 21/76865 (2013.01); H01L 23/53238 (2013.01); H01L 21/28562 (2013.01); H01L 21/76843 (2013.01);
Abstract

Atomic layer deposition (ALD) processes are combined with physical vapor deposition (PVD) processes in a low pressure environment to produce a high quality barrier film. The initial barrier film is deposited on a substrate using ALD processes and then moved to a PVD chamber to treat the barrier film to increase the barrier film's density and purity, decreasing the barrier film's resistivity. A dual source of materials is sputtered onto the substrate to provide doping while a gas is simultaneously used to etch the substrate to release nitrogen. At least one source of material is positioned to provide doping at an acute angle to the surface of the substrate while supplied with DC power and RF power at a first RF power frequency. The substrate is biased using RF power at a second RF power frequency.


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