The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 18, 2020

Filed:

Aug. 18, 2016
Applicant:

Disco Corporation, Tokyo, JP;

Inventors:

Ryogo Maji, Tokyo, JP;

Ryuji Oshima, Tokyo, JP;

Yoshiki Ishiai, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D 5/12 (2006.01); B24D 3/06 (2006.01);
U.S. Cl.
CPC ...
B24D 5/12 (2013.01); B24D 3/06 (2013.01);
Abstract

Disclosed herein is a cutting blade including diamond abrasive grains and boron compound grains. The average grain size of the diamond abrasive grains falls within the range of 5 μm to 50 μm. The average grain size of the boron compound grains is greater than ⅕ and less than or equal to ½ of the average grain size of the diamond abrasive grains.


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