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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10559743 B1

PDFFull Text
Date of Patent:
Feb. 11, 2020

Filed:

Aug. 30, 2017

Backside integration of rf filters for rf front end modules and design structure

Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

James W. Adkisson, Jericho, VT (US);

Panglijen Candra, Essex Junction, VT (US);

Thomas J. Dunbar, Burlington, VT (US);

Jeffrey P. Gambino, Westford, VT (US);

Mark D. Jaffe, Shelburne, VT (US);

Anthony K. Stamper, Williston, VT (US);

Randy L. Wolf, Essex Junction, VT (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorneys:

Anthony Canale

Andrew M. Calderon

Roberts Mlotkowski Safran Cole & Calderon, P.C.

Primary Examiner:

Latanya N Crawford

Int. Cl.
CPC ...
H01L 41/293 (2013.01); H01L 21/768 (2006.01); H01L 23/48 (2006.01); H01L 23/00 (2006.01); H03H 9/64 (2006.01); G06F 17/50 (2006.01); H01L 41/08 (2006.01); H01L 41/25 (2013.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01L 27/06 (2006.01); H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 41/293 (2013.01); G06F 17/5063 (2013.01); G06F 17/5068 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/24 (2013.01); H01L 41/0815 (2013.01); H01L 41/25 (2013.01); H03H 9/64 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 27/0694 (2013.01); H01L 28/40 (2013.01); H01L 2224/03009 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/14181 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/24145 (2013.01); H01L 2225/06548 (2013.01);
Abstract

A design structure for an integrated radio frequency (RF) filter on a backside of a semiconductor substrate includes: a device on a first side of a substrate; a radio frequency (RF) filter on a backside of the substrate; and at least one substrate conductor extending from the front side of the substrate to the backside of the substrate and electrically coupling the RF filter to the device.

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