The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Jun. 04, 2018
Disco Corporation, Tokyo, JP;
Atsushi Ueki, Tokyo, JP;
DISCO CORPORATION, Tokyo, JP;
Abstract
A wafer is divided at division starting points along division lines to form a predetermined gap between adjacent chips. Next, that area of a tape to which the wafer is adhered is suction held by a table, after which the table and a ring frame holding section are relatively moved further away from each other to expand the tape in a ring shape between an outer periphery of the wafer and an inner periphery of a ring frame. Thereafter, the table and the ring frame holding section are relatively moved closer to each other to slacken the ring-shaped tape, and the ring-shaped tape is heated by a heater, to heat shrink the tape and to maintain the predetermined gap between the adjacent chips.