The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Feb. 07, 2018
Applicant:

Screen Holdings Co., Ltd., Kyoto, JP;

Inventors:

Koji Kurasaki, Kyoto, JP;

Kenji Edamitsu, Kyoto, JP;

Masaharu Sato, Kyoto, JP;

Kei Takechi, Kyoto, JP;

Takeshi Matsumura, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/02 (2006.01); C03C 15/00 (2006.01); B08B 3/04 (2006.01); B08B 3/10 (2006.01); B08B 3/08 (2006.01); G01N 9/00 (2006.01); G01L 11/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67057 (2013.01); B08B 3/048 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); G01L 11/00 (2013.01); G01N 9/00 (2013.01); H01L 21/02052 (2013.01); H01L 21/67253 (2013.01); B08B 2203/007 (2013.01); C03C 15/00 (2013.01);
Abstract

A substrate treatment apparatus according to the present invention is provided with a first tank that stores treatment liquid for treating a substrate and a first path that returns the treatment liquid, which has spilled over from an upper part of the first tank, to a lower part of the first tank. A second path that branches from the first path, a measurement tank that stores the treatment liquid, which has flowed in from the second path, and a pressure measurement part that measures the pressure of the treatment liquid at a predetermined depth in the measurement tank in a state in which the treatment liquid spills over from an upper part of the measurement tank are provided. Therefore, techniques for highly precisely measuring the pressure of the treatment liquid used in treatment of substrates can be provided.


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