The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2020
Filed:
Sep. 27, 2013
Applicant:
Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;
Inventors:
Shuya Suenaga, Kanagawa, JP;
Teruhisa Matsumaru, Kanagawa, JP;
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 3/36 (2006.01); C08L 79/08 (2006.01); B32B 27/28 (2006.01); C08J 5/18 (2006.01); B32B 15/088 (2006.01); B32B 27/20 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B32B 15/088 (2013.01); B32B 17/064 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); C08K 3/36 (2013.01); B32B 2264/102 (2013.01); B32B 2307/306 (2013.01); B32B 2307/412 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01); B32B 2551/00 (2013.01); C08J 2379/08 (2013.01); Y10T 428/31623 (2015.04); Y10T 428/31681 (2015.04); Y10T 428/31721 (2015.04);
Abstract
Provided is a polyimide resin composition capable of forming a polyimide film which is excellent in transparency and heat resistance and has a low thermal linear expansion coefficient. The polyimide resin composition contains a polyimide resin produced by reacting (A) a tetracarboxylic dianhydride with (B) a diamine containing a phenolic hydroxyl group-containing diamine in an amount of from 5 to 100 mol % of the total diamine; and silica microparticles, in a ratio by mass of from 25/75 to 60/40.