The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 11, 2020

Filed:

Apr. 04, 2018
Applicant:

Senju Metal Industry Co., Ltd., Tokyo, JP;

Inventors:

Hiroyuki Yamasaki, Tokyo, JP;

Takashi Hagiwara, Tokyo, JP;

Hiroyoshi Kawasaki, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08K 5/17 (2006.01); B23K 35/362 (2006.01); C08K 5/5313 (2006.01); C08K 5/5317 (2006.01); C08L 93/04 (2006.01);
U.S. Cl.
CPC ...
B23K 35/362 (2013.01); C08K 5/17 (2013.01); C08K 5/5313 (2013.01); C08K 5/5317 (2013.01); C08L 93/04 (2013.01);
Abstract

An object of the present invention is to provide a flux in which the occurrence of a bridge and a ball is suppressed at the time of soldering, and a resin composition for the flux. The flux comprising: at least one selected from 0.3 to 2.0 mass % of an organochlorine compound, and more than 0.04 mass % and 1.00 mass % or less of an amine hydrochloride; and 0.2 to 1.5 mass % of an organophosphorus compound that is at least one selected from a phosphonic acid ester and a phenyl-substituted phosphinic acid, each based on the whole flux.


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