The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jul. 24, 2019
Applicants:

Foxconn (Kunshan) Computer Connector Co., Ltd., Kunshan, CN;

Foxconn Interconnect Technology Limited, Grand Cayman, KY;

Inventors:

Terrance F. Little, Fullerton, CA (US);

Patrick R. Casher, North Aurora, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01R 12/53 (2011.01); H01R 12/58 (2011.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01R 12/53 (2013.01); H01R 12/58 (2013.01); H05K 1/18 (2013.01); H05K 1/117 (2013.01); H05K 2201/10356 (2013.01); H05K 2201/10393 (2013.01); H05K 2201/10522 (2013.01); H05K 2201/10545 (2013.01);
Abstract

The QSFP-DD module has an internal printed circuit board defining a mating port at a front edge region, and a connecting port at a rear edge region, and plural sets of wires mechanically and electrically connected to the connecting port with a plurality of ground staples discrete from one another to secure the respective sets of wires to the printed circuit board. The pitch among the ground staples is essentially 3.38 mm, and the wires are connected to two opposite surfaces of the printed circuit board with the associated ground staples. The staples are arranged in rows along the transverse direction.


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