The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jun. 11, 2015
Applicant:

Ulvac, Inc., Chigasaki-shi, JP;

Inventors:

Hiroki Kobayashi, Chigasaki, JP;

Mitsunori Henmi, Chigasaki, JP;

Mitsutaka Hirose, Chigasaki, JP;

Shinnosuke Mashima, Chigasaki, JP;

Isao Kimura, Chigasaki, JP;

Koukou Suu, Chigasaki, JP;

Assignee:

ULVAC, INC., Chigasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); H01L 41/083 (2006.01); C23C 14/58 (2006.01); H01L 41/047 (2006.01); H01L 41/297 (2013.01); H01L 41/314 (2013.01);
U.S. Cl.
CPC ...
H01L 41/083 (2013.01); C23C 14/34 (2013.01); C23C 14/588 (2013.01); H01L 41/0471 (2013.01); H01L 41/297 (2013.01); H01L 41/314 (2013.01);
Abstract

A multi-layered film includes a first electroconductive layer, a dielectric layer, and a second electroconductive layer, which are sequentially layered and disposed on a main surface of a substrate. A lower surface of the dielectric layer comes into contact with an upper surface of the first electroconductive layer, an upper surface and an side surface of the dielectric layer is coated with the second electroconductive layer, and an side end of a portion at which the first electroconductive layer directly overlaps the second electroconductive layer is located inside a side end of the substrate on the main surface of the substrate.


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