The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Oct. 02, 2017
Applicant:

Applejack 199 L.p., San Jose, CA (US);

Inventors:

Wojciech Jan Walecki, Sunrise, FL (US);

Oanh Nguyen, Union City, CA (US);

Assignee:

APPLEJACK 199 L.P., Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); G01B 11/30 (2006.01); G01B 11/24 (2006.01); G01B 11/16 (2006.01); G01M 11/08 (2006.01); G01L 1/24 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1262 (2013.01); G01B 11/16 (2013.01); G01B 11/24 (2013.01); G01B 11/30 (2013.01); G01L 1/24 (2013.01); G01M 11/081 (2013.01); H01L 22/12 (2013.01);
Abstract

A method for non-contact measurement of stress in a thin-film deposited on a substrate is disclosed. The method may include measuring first topography data of a substrate having a thin-film deposited thereupon. The method may also include comparing the first topography data with second topography data of the substrate that is measured prior to thin-film deposition. The method may further include obtaining a vertical displacement of the substrate based on the comparison between the first topography data and the second topography data. The method may also include detecting a stress value in the thin-film deposited on the substrate based on a fourth-order polynomial equation and the vertical displacement.


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