The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

May. 18, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Deokhan Bae, Hwaseong-si, KR;

Hyonwook Ra, Hwaseong-si, KR;

Hyung Jong Lee, Osan-si, KR;

Juhun Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11 (2006.01); H01L 23/522 (2006.01); G11C 11/412 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1104 (2013.01); H01L 23/5226 (2013.01); H01L 27/092 (2013.01); G11C 11/412 (2013.01);
Abstract

A semiconductor device includes a substrate including active patterns, a device isolation layer filling a trench between a pair of adjacent active patterns, a gate electrode on the active patterns, and a gate contact on the gate electrode. Each active pattern includes source/drain patterns at opposite sides of the gate electrode. The gate contact includes a first portion vertically overlapping with the gate electrode, and a second portion laterally extending from the first portion such that the second portion vertically overlaps with the device isolation layer and does not vertically overlap with the gate electrode. A bottom surface of the second portion is distal to the substrate in relation to a bottom surface of the first portion. The bottom surface of the second portion is distal to the substrate in relation to a top of a source/drain pattern that is adjacent to the second portion.


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