The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jul. 26, 2018
Applicant:

Yangtze Memory Technologies Co., Ltd., Wuhan, Hubei, CN;

Inventor:

Shuai Guo, Hubei, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 21/66 (2006.01); H01L 23/544 (2006.01); B81C 3/00 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); B81C 3/004 (2013.01); H01L 22/20 (2013.01); H01L 23/544 (2013.01); H01L 25/50 (2013.01); H01L 2223/54426 (2013.01); H01L 2225/06593 (2013.01);
Abstract

Embodiments of methods and systems for adjusting wafer deformation during wafer bonding are provided. The method comprises: releasing inner rings of a first wafer, and applying a first gas pressure to the inner rings of the first wafer, such that the inner rings of the first wafer are in contact with a second wafer; releasing middle rings of the first wafer, such that the middle rings of the first wafer are deformed under a second gas pressure and in contact with the second wafer; releasing inner rings of the second wafer, and applying a third gas pressure less than the first gas pressure to the inner rings of the second wafer; releasing middle rings of the second wafer; and releasing outer rings of the first wafer and releasing outer rings of the second wafer simultaneously.


Find Patent Forward Citations

Guo, Shuai. (2020). Methods and systems for adjusting wafer deformation during wafer bonding (U.S. Patent No. 10553565). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10553565

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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