The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2020
Filed:
May. 29, 2014
Applicant:
Sumco Techxiv Corporation, Nagasaki, JP;
Inventor:
Kenji Yamashita, Tokyo, JP;
Assignee:
SUMCO TECHXIV CORPORATION, Nagasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B24B 37/005 (2012.01); B24B 37/34 (2012.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02024 (2013.01); B24B 37/005 (2013.01); B24B 37/345 (2013.01); H01L 21/02052 (2013.01); H01L 21/67057 (2013.01); H01L 21/67253 (2013.01); H01L 22/20 (2013.01);
Abstract
A method includes: polishing a semiconductor wafer by a polishing device; measuring a form of the semiconductor wafer by a measuring device before a polished surface of the semiconductor wafer becomes hydrophilic; and setting polishing conditions for the polishing based on a measurement result of the form of the semiconductor wafer by a polishing condition setting unit.