The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Mar. 10, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Kangguo Cheng, Schenectady, NY (US);

Juntao Li, Cohoes, NY (US);

Geng Wang, Stormville, NY (US);

Qintao Zhang, Mt. Kisco, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 27/24 (2006.01); H01F 27/28 (2006.01); H01F 41/14 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 27/24 (2013.01); H01F 27/2804 (2013.01); H01F 41/041 (2013.01); H01F 41/14 (2013.01); Y10T 29/4902 (2015.01); Y10T 29/49073 (2015.01); Y10T 29/49075 (2015.01);
Abstract

A method of making an inductor device includes forming a first metal layer and an ILD on a substrate, patterning a trench perpendicular to the first metal layer in the ILD, and depositing a magnetic material. The method includes depositing another ILD and patterning a via adjacent to the trench that extends from the first metal layer to a surface of the ILD. The method includes patterning trenches in the ILD, with a first portion over and adjacent to and parallel to the first metal layer, and a second portion perpendicular to the first portion and extending from an end of the first portion to the via. The first metal layer and trenches are connected to through the via. The method includes depositing a metal in the via, and depositing a metal in the trenches to form a second metal layer connected to the first metal layer through the via.


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