The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jul. 13, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Keith A. Jenkins, Sleepy Hollow, NY (US);

Barry P. Linder, Hastings-on-Hudson, NY (US);

Emily A. Ray, Hastings on Hudson, NY (US);

Raphael P. Robertazzi, Ossining, NY (US);

Peilin Song, Lagrangeville, NY (US);

James H. Stathis, Poughquag, NY (US);

Kevin G. Stawiasz, Bethel, CT (US);

Franco Stellari, Waldwick, NJ (US);

Alan J. Weger, Mohegan Lake, NY (US);

Emmanuel Yashchin, Yorktown Heights, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 11/00 (2006.01); G06F 11/22 (2006.01); G06F 11/24 (2006.01); G06F 11/263 (2006.01);
U.S. Cl.
CPC ...
G06F 11/2236 (2013.01); G06F 11/008 (2013.01); G06F 11/2273 (2013.01); G06F 11/24 (2013.01); G06F 11/263 (2013.01);
Abstract

A method and system are provided for chip testing. The method includes selectively deploying a chip for future use or discarding the chip to prevent the future use, responsive to a stress history of the chip determined using a non-destructive test procedure. The test procedure includes ordering each of a plurality of functional patterns by a respective minimum operating period corresponding thereto. The test procedure further includes ranking each of the plurality of patterns based on at least one preceding available pattern to provide a plurality of pattern ranks. The test procedure also includes calculating a sum by summing the plurality of pattern ranks. The sum calculated during an initial performance of the test procedure is designated as a baseline, and the sum calculated during a subsequent performance of the test procedure is compared to a threshold derived from the baseline to determine the stress history of the chip.


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