The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

May. 03, 2018
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Beijing Boe Display Technology Co., Ltd., Beijing, CN;

Inventors:

Xiaolong Li, Beijing, CN;

Xiaoxiang Zhang, Beijing, CN;

Huibin Guo, Beijing, CN;

Mingxuan Liu, Beijing, CN;

Wenqing Xu, Beijing, CN;

Zumou Wu, Beijing, CN;

Yongzhi Song, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/027 (2006.01); G02F 1/1343 (2006.01); H01L 27/12 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/786 (2006.01); G02F 1/1335 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
G02F 1/13439 (2013.01); G02F 1/133553 (2013.01); H01L 21/0274 (2013.01); H01L 21/32139 (2013.01); H01L 27/124 (2013.01); H01L 27/1222 (2013.01); H01L 27/1259 (2013.01); H01L 27/1262 (2013.01); H01L 27/1288 (2013.01); H01L 29/458 (2013.01); H01L 29/4908 (2013.01); H01L 29/78669 (2013.01); G02F 2203/02 (2013.01); H01L 29/78678 (2013.01);
Abstract

The present disclosure relates to a metal electrode, an array substrate and a method of producing the same, and a display device. In an embodiment, the method includes: forming a protection layer on a metal layer; patterning the protection layer to form a protection pattern, a profile of the protection pattern being the same as a profile of a predetermined pattern of the metal electrode; and etching a part of the metal layer not covered by the protection pattern to form the metal electrode, the metal electrode being covered by the protection pattern, wherein an etching anisotropy of the protection layer is larger than an etching anisotropy of the metal layer.


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