The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 04, 2020

Filed:

Jul. 26, 2017
Applicant:

Nikon Corporation, Tokyo, JP;

Inventors:

Yusuke Kawakami, Yokohama, JP;

Shohei Koizumi, Atsugi, JP;

Takashi Sugizaki, Yokohama, JP;

Assignee:

NIKON CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 133/14 (2006.01); C08F 20/36 (2006.01); C23C 18/20 (2006.01); C08F 20/06 (2006.01); H05K 3/18 (2006.01); H05K 3/38 (2006.01);
U.S. Cl.
CPC ...
C09D 133/14 (2013.01); C08F 20/06 (2013.01); C08F 20/36 (2013.01); C23C 18/20 (2013.01); H05K 3/181 (2013.01); H05K 3/387 (2013.01);
Abstract

Provided is a compound which is excellent terms of stability and tight adhesion to substrates and on which wiring can be formed by electroless plating. The compound is a high-molecular-weight compound having a constituent unit represented by the following formula (1). [In formula (1), R1 represents a hydrogen atom or a methyl group, m is an integer of 2-20, and Q represents a photosensitive leaving group].


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