The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Sep. 27, 2017
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Scott Mokler, Hillsboro, OR (US);
Timothy Swettlen, Portland, OR (US);
Kevin Byrd, Lake Oswego, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0028 (2013.01); H01L 23/49816 (2013.01); H05K 3/341 (2013.01); H05K 3/3494 (2013.01); H05K 9/0081 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/14 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19106 (2013.01); H05K 1/181 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/10371 (2013.01); H05K 2201/10378 (2013.01); H05K 2201/10734 (2013.01);
Abstract
Disclosed herein are arrangements for shielding in electronic assemblies, as well as related methods and devices. In some embodiments, an electronic assembly may include a circuit board having a first face and a second opposing face, and a shield coupled to the second face of the circuit board. The circuit board may have a hole extending therethrough, and the shield may extend into the hole towards the first face.