The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Oct. 24, 2018
Applicant:
Sumitomo Electric Device Innovations, Inc., Yokohama-shi, Kanagawa, JP;
Inventor:
Fumio Yamada, Yokohama, JP;
Assignee:
SUMITOMO ELECTRIC DEVICE INNOVATIONS, INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 29/423 (2006.01); H01L 29/778 (2006.01); H01L 29/20 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01); H01L 29/812 (2006.01);
U.S. Cl.
CPC ...
H01L 29/404 (2013.01); H01L 29/2003 (2013.01); H01L 29/42316 (2013.01); H01L 29/51 (2013.01); H01L 29/7783 (2013.01); H01L 29/7786 (2013.01); H01L 29/78 (2013.01); H01L 29/812 (2013.01);
Abstract
A semiconductor device implementing a field plate is disclosed. The semiconductor device includes electrodes of a source, a gate, and a drain; an insulating film covering at least the drain electrode; a field plate that includes a first part overlapping with the gate electrode and a second part not overlapping with the gate electrode; and a source interconnect connected with the source electrode. A feature of the semiconductor device of the invention is that both of the first part and the second part are electrically connected with the source interconnection.