The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jan. 30, 2019
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Shao-En Hsu, Kaohsiung, TW;

Huei-Shyong Cho, Kaohsiung, TW;

Shih-Wen Lu, Kaohsiung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01Q 1/22 (2006.01); H01P 3/12 (2006.01); H01Q 13/02 (2006.01); H01Q 19/08 (2006.01); H01Q 19/28 (2006.01); H01P 3/08 (2006.01); H01Q 13/08 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/3121 (2013.01); H01L 23/49838 (2013.01); H01P 3/08 (2013.01); H01P 3/121 (2013.01); H01Q 1/2283 (2013.01); H01Q 13/02 (2013.01); H01Q 13/08 (2013.01); H01Q 19/08 (2013.01); H01Q 19/28 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6627 (2013.01); H01L 2223/6677 (2013.01);
Abstract

An antenna semiconductor package device includes: (1) a waveguide cavity having a radiation opening; and (2) a first directing element outside of the waveguide cavity and separated from the waveguide cavity by a first gap.


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