The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Nov. 18, 2016
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventors:
Hans-Martin Ritter, Nahe, DE;
Joachim Utzig, Hamburg, DE;
Frank Burmeister, Langenhagen, DE;
Godfried Henricus Josephus Notermans, Hamburg, DE;
Jochen Wynants, Hamburg, DE;
Rainer Mintzlaff, Reinbek, DE;
Assignee:
Nexperia B.V., Nijmegen, NL;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/78 (2006.01); H01L 23/29 (2006.01); H01L 29/872 (2006.01); H01L 29/20 (2006.01); H01L 23/31 (2006.01); H01L 29/205 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 21/78 (2013.01); H01L 23/291 (2013.01); H01L 23/3171 (2013.01); H01L 23/3192 (2013.01); H01L 29/0649 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/872 (2013.01);
Abstract
A semiconductor device and a method of making the same. The device includes a substrate comprising a major surface and a backside. The device also includes a dielectric partition for electrically isolating a first part of the substrate from a second part of the substrate. The dielectric partition extends through the substrate from the major surface to the backside.