The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Feb. 28, 2018
Applicant:

Renesas Electronics Corporation, Koutou-ku, Tokyo, JP;

Inventors:

Hiroaki Sekikawa, Tokyo, JP;

Shigeo Tokumitsu, Ibaraki, JP;

Asuka Komuro, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/06 (2006.01); H01L 21/768 (2006.01); H01L 21/762 (2006.01); H01L 23/522 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 23/481 (2013.01); H01L 21/76224 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 27/0922 (2013.01); H01L 29/0653 (2013.01);
Abstract

A substrate contact plug which is connected to a wiring and a semiconductor substrate and does not form a circuit is formed in a seal ring region in a peripheral portion of a semiconductor chip region. The substrate contact plug is buried in a trench which is deeper than an element isolation trench.


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