The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Apr. 02, 2018
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Kenji Takenouchi, Tokyo, JP;

Assignee:

DISCO CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/3065 (2006.01); H01L 21/306 (2006.01); H01L 21/66 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); H01L 21/3065 (2013.01); H01L 21/30625 (2013.01); H01L 21/308 (2013.01); H01L 22/32 (2013.01);
Abstract

A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines includes the steps of holding the workpiece on a first holding table such that the layered bodies are exposed, thereafter, cutting the workpiece along the projected dicing lines with a cutting blade to form cut grooves that sever the layered bodies, thereafter, holding the workpiece on a second holding table such that a mask disposed in areas that are exclusive of the projected dicing lines is exposed, and thereafter, performing dry etching on the workpiece through the mask to sever the workpiece along the projected dicing lines. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.


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