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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10544255 B1

PDFFull Text
Expired
Date of Patent:
Jan. 28, 2020

Filed:

Mar. 29, 2016

Epoxy resin composition, prepreg and laminate prepared therefrom

Applicant:

Shengyi Technology Co., Ltd., Dongguan, Guangdong, CN;

Inventors:

Haosheng Xu, Dongguan, CN;

Xianping Zeng, Dongguan, CN;

Liexiang He, Dongguan, CN;

Assignee:

SHENGYI TECHNOLOGY CO., LTD., Dongguan, CN;

Attorneys:

McCarter & English, LLP

Steven G. Davis

Wei Song

Primary Examiner:

David T Karst

Int. Cl.
CPC ...
C08G 59/26 (2006.01); C08L 63/00 (2006.01); B32B 38/08 (2006.01); B32B 37/10 (2006.01); B32B 17/04 (2006.01); C08L 79/04 (2006.01); C08G 59/42 (2006.01); C08G 59/68 (2006.01); C08J 5/24 (2006.01); C08K 3/36 (2006.01); C08K 5/00 (2006.01); H05K 1/03 (2006.01); C08K 7/18 (2006.01);
U.S. Cl.
CPC ...
C08G 59/26 (2013.01); B32B 17/04 (2013.01); B32B 37/10 (2013.01); B32B 38/08 (2013.01); C08G 59/4223 (2013.01); C08G 59/686 (2013.01); C08J 5/24 (2013.01); C08K 3/36 (2013.01); C08K 5/0066 (2013.01); C08K 7/18 (2013.01); C08L 63/00 (2013.01); C08L 79/04 (2013.01); H05K 1/0306 (2013.01); H05K 1/0373 (2013.01); C08J 2363/00 (2013.01); C08J 2363/02 (2013.01); C08J 2479/04 (2013.01); C08K 2201/005 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01);
Abstract

The present invention relates to an epoxy resin composition, comprising the following components: (A) an epoxy resin containing oxazolidinone structure having the structure of the formula (1), (B) an active ester curing agent, and (C) a curing accelerator. The epoxy composition, prepreg, laminate and printed circuit board prepared from such epoxy composition have the following features of low coefficient of thermal expansion, low dielectric loss factor Df less than or equal to 0.0084, low water absorption and excellent moisture and heat resistance.

Find Patent Forward Citations

Xu, Haosheng. (2020). Epoxy resin composition, prepreg and laminate prepared therefrom (U.S. Patent No. 10544255). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10544255

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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