The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 28, 2020
Filed:
Oct. 28, 2015
Applicant:
Mitsubishi Materials Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); B22F 3/11 (2006.01); B22F 1/00 (2006.01); C22C 1/04 (2006.01); C22C 21/00 (2006.01); C22C 21/02 (2006.01);
U.S. Cl.
CPC ...
B22F 3/1103 (2013.01); B22F 1/00 (2013.01); B22F 3/11 (2013.01); C22C 1/04 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); B22F 2301/052 (2013.01); B22F 2304/10 (2013.01); Y10T 428/12056 (2015.01);
Abstract
A porous aluminum sintered material is provided. The porous aluminum sintered material includes aluminum substrates sintered each other, wherein pillar-shaped protrusions projecting toward an outside are formed on outer surfaces of the aluminum substrates, the porous aluminum sintered material has junctions in which the aluminum substrates are bonded each other through the pillar-shaped protrusions, the junctions include a Ti—Al compound, and a eutectic alloy phase including Al and Si is provided on surface layers of the junctions.