The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 28, 2020

Filed:

Jun. 02, 2017
Applicant:

National Chung Hsing University, Taichung, TW;

Inventors:

Wei-Ping Dow, Taichung, TW;

Wei-Yang Zeng, Taichung, TW;

Yi-Yung Chen, Taichung, TW;

Assignees:

NATIONAL CHUNG HSING UNIVERSITY, Taichung, TW;

TRIALLIAN CORPORATION, New Taipei, TW;

Other;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 7/22 (2006.01); H01L 21/02 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); B05D 7/24 (2006.01); C09D 5/24 (2006.01); C09D 7/61 (2018.01); C08G 73/02 (2006.01); H05K 3/42 (2006.01); C09D 1/00 (2006.01); C09D 179/02 (2006.01); B05D 7/00 (2006.01); C08K 3/04 (2006.01);
U.S. Cl.
CPC ...
B05D 7/22 (2013.01); B05D 7/24 (2013.01); B05D 7/54 (2013.01); B05D 7/58 (2013.01); C08G 73/0286 (2013.01); C09D 1/00 (2013.01); C09D 5/24 (2013.01); C09D 7/61 (2018.01); C09D 179/02 (2013.01); H01L 21/02104 (2013.01); H01L 21/02365 (2013.01); H01L 21/02376 (2013.01); H01L 21/02505 (2013.01); H01L 21/02527 (2013.01); H01L 21/02658 (2013.01); H01L 29/1606 (2013.01); H01L 29/66015 (2013.01); H05K 3/422 (2013.01); B05D 2350/30 (2013.01); B05D 2401/20 (2013.01); B05D 2505/00 (2013.01); C08K 3/042 (2017.05);
Abstract

Non-conductive substrates, especially the sidewalls of micro/nano holes thereof are chemically modified (i.e., chemically grafted) by reduced graphene oxide (rGO). The rGO possesses excellent electrical conductivity and therefore the modified substrates become conductive, so that it can be directly electroplated. These rGO-grafted holes can pass thermal shock reliability test after electroplating. The rGO grafting process possesses many advantages, such as a short process time, no complex agent (i.e., no chelator), no toxic agents (i.e., formaldehyde for electroless Cu deposition). It is employed in an aqueous solution instead of an organic solvent, and therefore is environmentally friendly and beneficial for industrial production.


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