The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

May. 18, 2018
Applicant:

Nxp Usa, Inc., Austin, TX (US);

Inventors:

Ning Zhu, Chandler, AZ (US);

Jeffrey Spencer Roberts, Tempe, AZ (US);

Damon G. Holmes, Scottsdale, AZ (US);

Jeffrey Kevin Jones, Chandler, AZ (US);

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03F 3/16 (2006.01); H03F 1/02 (2006.01); H03F 1/08 (2006.01); H01L 23/66 (2006.01); H01L 25/16 (2006.01); H01L 23/00 (2006.01); H01L 25/00 (2006.01); H03F 3/21 (2006.01); H03F 3/213 (2006.01); H03F 3/195 (2006.01);
U.S. Cl.
CPC ...
H03F 1/0288 (2013.01); H01L 23/66 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H03F 1/086 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H03F 3/213 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48195 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/13064 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19107 (2013.01); H03F 2200/222 (2013.01); H03F 2200/267 (2013.01); H03F 2200/387 (2013.01); H03F 2200/451 (2013.01); H03F 2200/552 (2013.01);
Abstract

Embodiments of RF amplifiers and packaged RF amplifier devices each include a transistor with a drain-source capacitance that is relatively low, an input impedance matching circuit, and an input-side harmonic termination circuit. The input impedance matching circuit includes a harmonic termination circuit, which in turn includes a first inductance (a first plurality of bondwires) and a first capacitance coupled in series between the transistor output and a ground reference node. The input impedance matching circuit also includes a second inductance (a second plurality of bondwires), a third inductance (a third plurality of bondwires), and a second capacitance coupled in a T-match configuration between the input lead and the transistor input. The first and second capacitances may be metal-insulator-metal capacitors in an integrated passive device.


Find Patent Forward Citations

Loading…