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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10538627 B1

PDFFull Text
Date of Patent:
Jan. 21, 2020

Filed:

Nov. 28, 2017

Polyimide precursor composition, photosensitive resin composition, cured film, method for producing cured film, a semiconductor device, and method for producing polyimide precursor composition

Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Takeshi Kawabata, Haibara-gun, JP;

Takuma Amemiya, Haibara-gun, JP;

Hidekazu Oohashi, Haibara-gun, JP;

Yu Iwai, Haibara-gun, JP;

Akinori Shibuya, Haibara-gun, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Cynthia Hamilton

Int. Cl.
CPC ...
C08G 73/10 (2006.01); G03F 7/021 (2006.01); G03F 7/023 (2006.01); G03F 7/038 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); C08F 290/14 (2006.01); G03F 7/031 (2006.01); G03F 7/037 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); G03F 7/40 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1067 (2013.01); C08F 290/145 (2013.01); C08G 73/10 (2013.01); G03F 7/021 (2013.01); G03F 7/0212 (2013.01); G03F 7/0233 (2013.01); G03F 7/031 (2013.01); G03F 7/037 (2013.01); G03F 7/0387 (2013.01); G03F 7/0388 (2013.01); G03F 7/162 (2013.01); G03F 7/168 (2013.01); G03F 7/2004 (2013.01); G03F 7/322 (2013.01); G03F 7/325 (2013.01); G03F 7/40 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 24/29 (2013.01); H01L 25/065 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16146 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06565 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/15174 (2013.01); H01L 2924/15311 (2013.01);
Abstract

A photosensitive resin composition using a polyimide precursor composition, a cured film, a method for producing a cured film, a semiconductor device, and a method for producing a polyimide precursor composition are provided. In the polyimide precursor composition, the molar ratio of repeating units represented by General Formula (1-2) among structural isomers of the polyimide precursor is 60% to 90% by mole. In General Formula (1-2), Aand Aeach independently represents an oxygen atom or NH, Rand Reach independently represents a single bond or a divalent organic group, and Rand Reach independently represents a hydrogen atom or a monovalent organic group.

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