The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Nov. 02, 2011
Oscar Khaselev, Monmouth Junction, NJ (US);
Bin MO, East Brunswick, NJ (US);
Michael T. Marczi, Chester, NJ (US);
Bawa Singh, Voorhees, NJ (US);
Monnir Boureghda, East Stroudsburg, PA (US);
Oscar Khaselev, Monmouth Junction, NJ (US);
Bin Mo, East Brunswick, NJ (US);
Michael T. Marczi, Chester, NJ (US);
Bawa Singh, Voorhees, NJ (US);
Monnir Boureghda, East Stroudsburg, PA (US);
Alpha Assembly Solutions Inc., South Plainfield, NJ (US);
Abstract
Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.