The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 14, 2020

Filed:

Dec. 21, 2017
Applicant:

Medtronic, Inc., Minneapolis, MN (US);

Inventors:

David A. Ruben, Mesa, AZ (US);

Michael S. Sandlin, Chandler, AZ (US);

Assignee:

Medtronic, Inc., Minneapolis, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); A61N 1/375 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); A61N 1/3754 (2013.01); H01L 21/486 (2013.01); H01L 21/4853 (2013.01); H01L 23/49838 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Various embodiments of a feedthrough assembly and methods of forming such assemblies are disclosed. In one or more embodiments, the feedthrough assembly can include a non-conductive substrate and a feedthrough. The feedthrough can include a via from an outer surface to an inner surface of the non-conductive substrate, a conductive material disposed in the via, and an external contact disposed over the via on the outer surface of the non-conductive substrate. The external contact can be electrically coupled to the conductive material disposed in the via. And the external contact can be hermetically sealed to the outer surface of the non-conductive substrate by a bond surrounding the via. In one or more embodiments, the bond can be a laser bond.


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