The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2020
Filed:
Jun. 27, 2016
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chun Hao Liao, Hsinchu, TW;
Chu Fu Chen, Zhubei, TW;
Mingo Liu, Hsinchu, TW;
Chiou Jun Yean, Jhudong Township, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
An assembly includes a wafer having a top wafer surface and a wafer circumference and a device arrangement structure. The device arrangement structure includes a first surface having a perimeter, the perimeter being encircled by the wafer circumference in a plan view. The device arrangement structure also includes an array of devices, each device of the array of devices having an electrical contact on the first surface. The assembly has an adhesive element that affixes the device arrangement structure in a stationary position relative to the wafer.